Integrated Passive Devices Market, Analysis, Strategic Assessment, Trend Outlook And Business Opportunities by Fact MR

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According to a recently published Fact.MR report, the global Integrated Passive Devices market is projected to grow at a compound annual rate (CAGR) of 10.3% between 2022 and 2032. The market is expected to reach US$ 3.23 Bn by the end of 2032. The demand for Integrated Passive Devices is expected to rise over the forecast period and the market was valued US$ 1.1Bn in 2021.

Browse in-depth TOC on "Demand of Integrated Passive Devices Market"

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Integrated passive devices would aid in the reduction of the size and power consumption of telecom infrastructure items, boosting the integrated passive devices market in the next years, particularly in the telecom industry.

By 2022, the 5G industry is estimated to have 89 million subscribers, giving the integrated passive devices market room to expand. High-efficiency 5G integrated passive devices RF filters were created by 3D Glass Solutions.

Key players in the Sales of Integrated Passive Devices Market

  • Texas Instruments Incorporated
  • Qurvo, Inc.
  • Murata Manufacturing Co. Ltd.
  • NXP Semiconductors
  • ON Semiconductors

Recent Developments in the Integrated Passive Devices Market

  • TDK Corporation introduced a new line of EPCOS power capacitors for DC link applications in May 2021. The new capacitors are offered with rated voltages ranging from 700 V DC to 2000 V DC and capacitances ranging from 20 F to 270 F.
  • Vishay Intertechnology released a new Automotive Grade through-hole inductor with a 420 A saturation current and a 30% inductance decrease in a 1500 case size in March 2021. The IHXL-1500VZ-5A delivers an extremely low typical DCR of 0.12 m and continuous high-temperature operation to +155 °C for automotive applications.
  • Panasonic announced the EEH-ZK(U) Series Conductive Polymer Hybrid Aluminum SMD Electrolytic Capacitors in January 2021, which combine the benefits of electrolytic capacitors with solid polymer capacitors. High-temperature tolerance and compact case sizes are available.

 

 

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